发明名称 |
METHOD OF MANUFACTURING RIGID FLEXIBLE PRINTED CIRCUIT BOARD |
摘要 |
Disclosed herein is a method of manufacturing a rigid flexible printed circuit board, including: preparing a flexible substrate having an inner layer circuit pattern formed on one surface or both surfaces thereof and divided into a rigid region and a flexible region; forming a protective layer in the flexible region of the flexible substrate; forming a coverlay so as to expose the protective layer on one surface of the flexible substrate; stacking a rigid insulating layer in the rigid region and stacking a metal layer in the protective layer and the rigid insulating layer; forming an outer layer circuit layer by patterning the metal layer and removing the metal layer in the flexible region; and removing the protective layer. |
申请公布号 |
US2014082937(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201314034000 |
申请日期 |
2013.09.23 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK JUNG YONG;SONG SEOK CHEOL;JUNG MYONG KEUN;JOUNG JAE WOO |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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