发明名称 HEAT RADIATION ARRANGEMENT
摘要 A disclosed heat radiation arrangement includes a substrate that has a first surface on which a heating element is installed; a heat radiating member that abuts a surface of the heating element via a thermal conductive elastic member, the surface of the heating element being on an opposite side with respect to a side of the first surface; and a casing to which the substrate and the heat radiating member are attached, wherein the substrate is secured to the casing within a region between two extended sides and on opposite sides of the heating element when viewed in a direction perpendicular to the first surface, these two extended sides being defined by extending two opposite sides of the heating element, which form outer edges of the heating element, toward outer edges of the first surface.
申请公布号 US2014083994(A1) 申请公布日期 2014.03.27
申请号 US201114009438 申请日期 2011.07.07
申请人 TAKAHASHI HISAO;ANADA SATORU;IWAZUMI TORU;TOYOTA JIDOSHA KABUSHIKI KAISHA 发明人 TAKAHASHI HISAO;ANADA SATORU;IWAZUMI TORU
分类号 H05K7/20;H05B3/22 主分类号 H05K7/20
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