| 摘要 |
<p>A delamination device delaminates a superimposition substrate in which a first substrate and a second substrate are joined to the first substrate and the second substrate. The superimposition substrate is arranged in an opening unit of a frame having an opening unit. The size of the opening unit is larger than the superimposition substrate. The superimposition substrate connects a non-junction surface of the first substrate to a tape installed in the opening unit and is supported by the frame. A first possession support unit supports the second substrate from an upper part. A second possession support unit supports the first substrate from a lower part by interposing the tape. A moving tool moves the first possession support unit to a direction which is separated from the second possession support unit.</p> |
