| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can average temperatures of a plurality of semiconductor modules when the plurality of semiconductor modules are arranged in parallel with each other along a cooling flow.SOLUTION: A semiconductor device comprises: at least two semiconductor modules each of which includes a plurality of semiconductor circuits CS1-CS8 in each of which at least one and more semiconductor chips 5A having gate terminals and gate resistances Rg1-Rg8 connected to the gate terminals are mounted, and which are arranged on a coolant 10 in a direction where an arrangement direction of the semiconductor circuits crosses a refrigerant flow; and at least one temperature detection resistance Rt1, Rt2 arranged in each semiconductor module. A gate signal is supplied to a gate signal input terminal of one semiconductor module between the two semiconductor modules via the temperature detection resistance of the other semiconductor module. A gate signal is supplied to a gate signal input terminal of the other semiconductor module via the temperature detection resistance of the one semiconductor module. |
