发明名称 METHOD FOR PRODUCING CONDUCTIVE LAYER AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a conductive layer, which is capable of forming a conductive layer exhibiting excellent conductivity.SOLUTION: The method for producing a conductive layer comprises a reduction step of irradiating a precursor layer-attached support, which has a support and a precursor layer disposed on the support and containing copper oxide particles, with light to reduce the copper oxide particles, thereby forming a conductive layer containing metal copper. The filling rate of the copper oxide particles in the precursor layer is 65% or more.
申请公布号 JP2014057024(A) 申请公布日期 2014.03.27
申请号 JP20120202421 申请日期 2012.09.14
申请人 FUJIFILM CORP 发明人 OTA HIROSHI
分类号 H05K3/10;B22F7/04;H01B13/00 主分类号 H05K3/10
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