| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which can consistently reinforce a wafer from thinning of the wafer to an inspection of semiconductor device electric characteristics; and provide a semiconductor device manufactured by the manufacturing method, a support substrate and a semiconductor manufacturing apparatus.SOLUTION: A semiconductor device manufacturing method comprises: a process of applying to a rear face side of a semiconductor substrate to which a first support substrate is applied on a surface side where semiconductor devices are formed, a second support substrate in which through holes are formed in a manner such that the through holes overlap the semiconductor devices, respectively; a process of detaching the first support substrate; a process of measuring electric characteristics of the semiconductor devices by bringing probes of an electric characteristic inspection device into contact with a surface electrode of each semiconductor device exposed by detachment of the first support substrate and a back electrode which is exposed from each through hole, of each semiconductor device; a process of sucking the semiconductor device by a collet from the surface side of the semiconductor substrate; and a process of picking up the semiconductor device by a pick-up pin from the through hole. |
