| 摘要 |
The invention relates to a cooling device (100) for a circuit (200) having a support part (120) for holding the circuit (200) and a cooling element (110) for holding the support part (120) and a metalliferous boundary layer (130a), infiltrated in the support part (120) and/or the cooling element (110), between the support part (120) and the cooling element (110), which connects the support part (120) and the cooling element (110) in a firmly bonded, planar manner, and serves to compensate for the differing thermal expansions of the support part (120) and the cooling element (110) and for thermal transfer from the support part (120) to the cooling element (110). Said cooling device is efficient and cost-effective, and ensures error-free functionality of the circuit, despite strong temperature fluctuations. |
