发明名称 METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
摘要 A substrate comprising a solid glass core having a first surface and a second surface opposed to the first surface; multiple conductors extending through the solid glass core beginning at the first surface and ending at the second surface, wherein one of the conductors has a third surface and a fourth surface, wherein the third surface and the first surface are substantially coplanar, wherein the second surface and the fourth surface are substantially coplanar, wherein one of the conductors comprise a copper-tungsten alloy material, wherein the solid glass core is directly contact with the conductor; and a first dielectric layer and a first metal layer formed at the first surface, wherein the first metal layer at the first surface is electrically coupled with one of the conductors.
申请公布号 US2014085842(A1) 申请公布日期 2014.03.27
申请号 US201314036256 申请日期 2013.09.25
申请人 YANG PING-JUNG 发明人 YANG PING-JUNG
分类号 H05K1/09 主分类号 H05K1/09
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