发明名称 |
LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND PACKING UNIT THEREOF |
摘要 |
A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer. |
申请公布号 |
US2014083755(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201213713747 |
申请日期 |
2012.12.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE SUN CHEOL;KIM WOO SUP;KIM DONG GUN;KIM KYEONG JUN;LEE KYU HO |
分类号 |
H05K1/18;H01C7/00;H01C7/10;H01G4/12;H01L41/083;H05K1/03 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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