| 摘要 |
<p>The present invention improves reliability by minimizing the incidence of cracking in a joining member for joining a circuit substrate and a second member. In a semiconductor module (10), a heat dissipation member (40) has a first member (41) and a second member (42) that has a coefficient of linear expansion no less than that of a circuit substrate (30) and that forms a gap (44) between the second member (42) and the inner wall of a recessed opening (43) formed in the primary surface of the first member (41). Since the other primary surface of the circuit substrate (30) is connected to the second member (42) via a joining member (50), the heat dissipation member (40) is capable of reducing the difference in coefficients of linear expansion between the members disposed above and below the joining member (50), reducing the stress on the joining member (50), and reducing the incidence of cracking or delamination of the joining member (50). Since the gap (44) is provided, the second member (42) is able to stretch so as to accommodate stress, and any action from the inner wall of the first member (41) on the second member (42) is minimized.</p> |
