| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding machine capable of preventing random comminution of an outer peripheral portion which is caused by a grinding load applied during grinding work.SOLUTION: A grinding machine (1) includes: a pressing roller (7) for pressing an outer peripheral part of a wafer (W); a pressing part (72) which moves the pressing roller (7) close to or away from the outer peripheral part of the wafer (W) and presses a side surface part of the pressing roller (7) to the outer peripheral part of the wafer (W); and a support part (71) which supports the pressing roller (7) so as to rotate with a center axis of the pressing roller (7) set as a rotation axis. The grinding machine rotates a chuck table (3) using chuck rotation means in a state where the side surface part of the pressing roller (72) is pressed to the outer peripheral part of the wafer (W) by the pressing part (72) thereby causing the pressing roller (7) to crush the outer peripheral part of the wafer (W). |
