发明名称 |
CHIP SUPPORT SUBSTRATE, METHOD FOR SUPPORTING CHIP, THREE-DIMENSIONAL INTEGRATED CIRCUIT, ASSEMBLY DEVICE, AND METHOD FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT |
摘要 |
The present invention is a chip support substrate provided with a lyophilic region (4) formed on the substrate and holding a chip (3A) using suction, and an electrode (6) formed within the lyophilic region on the substrate, and used for generating electrostatic force on the chip. The present invention is also a method for supporting a chip including: a step for positioning the chip in a lyophilic region of a chip support substrate provided with the lyophilic region, which is formed on the substrate, and an electrode formed within the lyophilic region on the substrate, a fluid (15) being interposed between the chip and the lyophilic region; and a step for generating an electrostatic force on the chip corresponding to the electrode by applying voltage to the electrode. |
申请公布号 |
WO2014046052(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
WO2013JP74876 |
申请日期 |
2013.09.13 |
申请人 |
TOHOKU UNIVERSITY |
发明人 |
KOYANAGI, MITSUMASA;TANAKA, TETSU;FUKUSHIMA, TAKAFUMI |
分类号 |
H01L23/12;H01L21/52;H01L21/60;H01L23/32;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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