发明名称 REINFORCING FIBER BUNDLE AND COMPOSITE MATERIAL USING SAME
摘要 <p>A reinforcing fiber bundle that has been treated so as to attach microparticles to the surfaces of the fibers. Said microparticles comprise a thermoplastic resin, and in a particle-size distribution obtained by laser diffraction scattering, the D90 of the microparticles is less than 1.5 µm. The D10 of the microparticles is preferably greater than or equal to 0.05 µm, and it is preferable that at least 30% of the microparticles are less than 0.2 µm in diameter. It is also preferable that the microparticles comprise a polyamide resin. It is further preferable that the reinforcing fibers are carbon fibers and that the reinforcing fiber bundle has a flattened shape with a thickness less than or equal to 200 µm.</p>
申请公布号 WO2014045981(A1) 申请公布日期 2014.03.27
申请号 WO2013JP74602 申请日期 2013.09.05
申请人 TEIJIN LIMITED 发明人 SAKURAI, HIROSHI;ONO, TSUBASA;NAITO, TAKESHI
分类号 B29B15/08;B29B11/16;C08J5/06;D06M15/59 主分类号 B29B15/08
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