| 摘要 |
The forming mold has a base member 10, a resin layer 20 which is bonded to the base member 10 and which serves as a forming surface, and a bonding layer 30 which intervenes between the base member 10 and the resin layer 20 and which bonds the base member 10 to the resin layer 20. The base member 10 has a rigidity higher than that of the resin layer 20. The forming mold may be produced through bonding the resin layer 20 to the base member 10 by use of an adhesive, and the surface of the bonded resin layer 20 is worked, to thereby form the "forming surface" of the resin layer 20. Alternatively, the forming mold may be produced through forming the resin layer 20 having a "forming surface" and bonding the formed resin layer 20 to the base member 10 by use of an adhesive. The present invention enables provision of a forming mold having enhanced dimensional precision of the resin layer actually serving as a forming surface. |
