发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a thinning processing method for dry film resist capable of uniformly thinning the dry film resist. <P>SOLUTION: The thinning processing method for dry film resist includes sticking the dry film resist onto a substrate, rinsing in water, and thinning with an aqueous alkali solution containing 5-20 mass% of an inorganic alkaline compound. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5455696(B2) 申请公布日期 2014.03.26
申请号 JP20100027740 申请日期 2010.02.10
申请人 发明人
分类号 G03F7/38;G03F7/004;H05K3/06 主分类号 G03F7/38
代理机构 代理人
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