发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a solar cell capable of suppressing a plasma from damaging a wafer light-receiving surface and suppressing a scraping amount of a diffusion layer by reducing etching more than necessary. <P>SOLUTION: A manufacturing method of a solar cell comprises: a first step of forming a diffusion layer 2 on a main surface and a side surface of a semiconductor substrate 1 of a first conductivity type by diffusing an impurity of a second conductivity type different from the first conductivity type; a second step of providing a protection region in a peripheral part of the main surface of the semiconductor substrate; a third step of forming a texture structure by etching the main surface of the semiconductor substrate inside the protection region; and a fourth step of stacking a plurality of the semiconductor substrates which passed the first to third steps so that the main surfaces of the semiconductor substrates face in the same direction and removing the diffusion layer by etching the side surfaces of the semiconductor substrates. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5452535(B2) 申请公布日期 2014.03.26
申请号 JP20110080458 申请日期 2011.03.31
申请人 发明人
分类号 H01L31/06 主分类号 H01L31/06
代理机构 代理人
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