发明名称 TFT module having Multi-layer Back-cover
摘要 The present invention relates to a TFT panel of a structure which efficiently prevents heat from being transmitted from a circuit component to the TFT panel when the circuit component is driven to operate the TFT panel. A TFT module includes: a TFT panel; an insulation layer on the rear side of the TFT panel; a heating layer on at least one side of the insulation layer; and a TFT driving device on the rear side of the TFT panel. The heating layer is made of aluminum. The TFT module further includes a nut member which is fixated to a back cover including the insulation layer and the heating layer.
申请公布号 KR101372446(B1) 申请公布日期 2014.03.26
申请号 KR20120048945 申请日期 2012.05.09
申请人 发明人
分类号 G02F1/1333;G02F1/1345 主分类号 G02F1/1333
代理机构 代理人
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