| 摘要 |
The present invention relates to a die bonder capable of recognizing the position of a die accurately regardless of the status of the die on a wafer. The present invention comprises a photographing part for photographing the wafer; a memory part for memorizing a image of the wafer photographed by the photographing part, a recognition pattern in which the contour of the die formed at the wafer is memorized, and a recognition program; a communication part receiving map data indicating the status of each die of the wafer; and a control operation part for securing the central position of the die by comparing the recognition pattern with the die formed at the wafer by executing the recognition program and securing the position of the wafer with the excellent map data on the wafer. The recognition pattern of the die, in which the contour is memorized, secures the central position of the die by comparing the recognition pattern with the die formed at the wafer by execution of the recognition program by the control operation part. [Reference numerals] (AA) Map data; (BB) Recognition pattern; (CC) Dicing groove |
