发明名称 Wafer cutting system
摘要 The invention relates to a wafer receiving box (3) for receiving wafers (5), the wafer receiving box (3) having in a first area (11) a width (W1), characterized in that the wafer receiving box (3) has in a further area (12, 13) which is above and/or below said first area portions (6) laterally extending beyond the width (W1) of said first area (11) such that the width (W2) of the wafer receiving box (3) in said further area (12, 13) is larger than the width (W1) of said first area (11).
申请公布号 EP2711979(A1) 申请公布日期 2014.03.26
申请号 EP20120185756 申请日期 2012.09.24
申请人 MEYER BURGER AG 发明人 WENGER, MARKUS;SCHNYDER, MATTHIAS;HEINIGER, CHRISTOPH
分类号 H01L21/673;B28D5/00;H01L21/67 主分类号 H01L21/673
代理机构 代理人
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