| 摘要 |
<p>A method for transporting solder spheres (110) comprises the following steps: providing a plurality of solder spheres (110) in a sphere chamber (102), blowing nitrogen gas into the sphere chamber (102) such that the solder spheres (110) are transported towards a tooling plate (104), and positioning the solder spheres (110) at desired positions on the tooling plate (104). A device for transporting solder spheres (110) comprises a sphere chamber (102), in which a plurality of solder spheres (110) can be provided, means (112) for blowing nitrogen gas into the sphere chamber (102), and a tooling plate (104). The invention provides a simple and effective way for transporting solder spheres to the desired positions on the tooling plate, which can avoid or minimize oxidation effects.</p> |
