| 摘要 |
The present invention relates to a method of manufacturing a semiconductor cooling device and a semiconductor cooling device which includes at least one heat pipe, at least one semiconductor, and a hydraulic fluid which is inserted into the heat pipe. The present invention provides a method and a means which can perfectly solve all the problems due to semiconductor overheat such as the performance deterioration and lifetime reduction of a semiconductor by an innovative composition and method for quickly radiating heat generated from the semiconductor. |
