摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a board component structure, for excellently securing a yield by effectively utilizing both of an easy-to-plate thermoplastic resin and a hard-to-plate thermosetting resin and contriving an integrated molding process. SOLUTION: A base plate member 110a and a front side housing member 110b are molded with an ABS resin. Thereafter, a chucker member 120 is molded from a PC resin by integrated molding with the base plate member 110a and the front side housing member 110b so as to be bonded to the base plate member 110a from the upper side, and then a plating film M is formed on the base plate member 110a. COPYRIGHT: (C)2011,JPO&INPIT |