| 摘要 |
1,103,905. Semi-conductor devices; electric component assemblies. SIEMENS A.G. 20 Sept., 1965 [21 Sept., 1964], No. 39962/65. Headings H1K and H1R. The space between a semi-conductor or other circuit element and the walls of a housing is filled with a thermoplastic or cold or thermosetting resin in liquid form which is subsequently hardened in situ. The resin which must be capable of being hardened without substantial change of volume contains a filler acting as a getter or water vapour. The housing may be of glass, metal or synthetic resin and the element a diode or germanium mesa transistor. Suitable resins which may be poured or sprayed into the housing are phenol-formaldehyde, polyvinyl silicone, and epoxy resins, and polystyrene. Oxides of calcium, boron and barium, and zeolites may be used as water getters and alumina and magnesia may also be incorporated in the resin to improve heat dissipation. The fillers are preferably in the form of particles 0À1-100Á across and may amount to 400% by weight of the resin. They may be concentrated in certain parts of the housing by settling or centrifuging. |
