发明名称 |
HEAT SINK FOR COOLING POWER ELECTRONICS |
摘要 |
A heat sink device for cooling a power electronics module includes a base platform having a first surface and a second surface on opposite sides of the base platform, a plurality of upright members extending outwardly from the first surface of the base platform and defining a cavity wherein the power electronics module is disposed in conductive heat exchange relationship with the first surface of the base platform, and a plurality of heat transfer fins extending outwardly from the second surface of the base platform and defining a plurality of cooling air flow channels. |
申请公布号 |
EP2710631(A1) |
申请公布日期 |
2014.03.26 |
申请号 |
EP20120717956 |
申请日期 |
2012.04.12 |
申请人 |
CARRIER CORPORATION |
发明人 |
TARAS, MICHAEL F.;LEE, KEONWOO;PERKOVICH, MARK J.;DURAISAMY, SURESH;LIAO, XUQIANG |
分类号 |
H01L23/36;H01L23/367;H01L23/467 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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