发明名称 |
Composite semiconductor device, print head and image forming apparatus |
摘要 |
<p>A composite semiconductor device is formed of a semiconductor wafer having a plurality of device-forming areas in which semiconductor elements are formed and dicing areas defined between the device-forming areas, and is formed by dicing the semiconductor wafer at the dicing areas. The composite semiconductor device includes a semiconductor substrate, and a plurality of wiring layers layered on the semiconductor substrate. The wiring layers include at least conductive films. Connecting portions are formed to connect the wiring layers with each other in a layering direction of the wiring layers. Each of the connecting portions is disposed on the device-forming area side with respect to a dicing position defined in the dicing area.</p> |
申请公布号 |
EP2141022(B1) |
申请公布日期 |
2014.03.26 |
申请号 |
EP20090161214 |
申请日期 |
2009.05.27 |
申请人 |
OKI DATA CORPORATION |
发明人 |
TANINAKA, MASUMI;KOIZUMI, MASUMI;HAMANO, HIROSHI;JYUMONJI, SHINYA;OHKAWA, KAZUYA |
分类号 |
B41J2/45;H01L21/78;H01L27/15 |
主分类号 |
B41J2/45 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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