The present invention relates to a method for manufacturing a printed circuit board comprising a pillar part using a mask and the printed circuit board manufactured thereby. The present invention includes: a mask setting step of locating the mask with a through part on a substrate; a pillar part forming step of forming the pillar part on the substrate by injecting liquefied resins through the through part of the mask; a mask removing step of removing the mask to leave the pillar part on the substrate; and a circuit part forming step of forming a conductive circuit part by injecting and curing paste made by mixing a conductive fine particle with floating resins with adhesion between the pillar parts of the substrate.
