| 摘要 |
<p>An electronic circuit (200, 300, 400, 500) which comprises a flat circuit board with a layer of a non-conducting material with opposing first and second main surfaces, with a central ground pad arranged on a part of the first main surface and a ground plane arranged on the second main surface which protrudes beyond the central ground pad. There is a flat no leads package (100) arranged on the central ground pad. The flat no leads package (100) comprises a central plate (105) with protrusions (110, 120, 130, 140) which protrude beyond the central ground pad and overlap the ground plane (210). The electronic circuit (200, 300, 400, 500) comprises a grounding network (235, 240, 245, 230; 405, 435; 535, 545) connected to the ground plane (213) and to at least one protrusion (110, 120, 130, 140), thereby connecting the at least one protrusion (110, 120, 130, 140) electrically to the ground plane (210).</p> |
