| 摘要 |
Disclosed is a resin composition which has low stress and improved adhesion properties in high temperature and high humidity environments and is useful for application to an adhesive in a civil level electronic component package with low stress and high moisture. Preferably, disclosed is a flexible epoxy-anhydride byproduct modified solid bismaleimide and solid benzoxazine resin composition which is stable in high temperature and high humidity environments, maintains improved adhesive strength, and reduces stress due to the disharmony of thermal expansion coefficient between a silicon die and a substrate that is a ball grid array solder mask, a smart card polyethylene terephthalate, or a silver or copper metal lead frame. |
