发明名称 |
Coplanar waveguide for stacked multi-chip systems |
摘要 |
An approach for a coplanar waveguide structure in stacked multi-chip systems is provided. A method of manufacturing a semiconductor structure includes forming a first coplanar waveguide in a first chip. The method also includes forming a second coplanar waveguide in a second chip. The method further includes directly connecting the first coplanar waveguide to the second coplanar waveguide using a plurality of chip-to-chip connections. |
申请公布号 |
US8680689(B1) |
申请公布日期 |
2014.03.25 |
申请号 |
US201213644269 |
申请日期 |
2012.10.04 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK TIMOTHY H.;DING HANYI;SAUTER WOLFGANG;WANG GUOAN;WOODS, JR. WAYNE H. |
分类号 |
H01L21/31 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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