发明名称 Coplanar waveguide for stacked multi-chip systems
摘要 An approach for a coplanar waveguide structure in stacked multi-chip systems is provided. A method of manufacturing a semiconductor structure includes forming a first coplanar waveguide in a first chip. The method also includes forming a second coplanar waveguide in a second chip. The method further includes directly connecting the first coplanar waveguide to the second coplanar waveguide using a plurality of chip-to-chip connections.
申请公布号 US8680689(B1) 申请公布日期 2014.03.25
申请号 US201213644269 申请日期 2012.10.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DAUBENSPECK TIMOTHY H.;DING HANYI;SAUTER WOLFGANG;WANG GUOAN;WOODS, JR. WAYNE H.
分类号 H01L21/31 主分类号 H01L21/31
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