| 摘要 |
A device for testing a semiconductor device is disclosed. According to one aspect, a socket to which a semiconductor device is inserted and a socket cover unit are provided. As the socket and the socket cover unit are combined one-to-one, the electrical connection of the semiconductor device is maintained. According to another aspect, a plurality of sockets is arranged on a tester board. Each socket is able to test a semiconductor device when the semiconductor device is inserted and is at a connection position for electrical connection. Also an arrangement/pressurization structure for pressurizing part of or all semiconductor devices inserted into the sockets at the same time for placing the semiconductor devices at each connection position is included. By having the structure described above, the number of devices which can be tested at the same time is increased; the index time is reduced; and accordingly testing efficiency and productivity can be enhanced. |
