发明名称 |
Backgrind process for integrated circuit wafers |
摘要 |
An integrated circuit is formed by coating a top surface of a wafer that has been processed through all integrated circuit chip manufacturing steps prior to backgrind with photoresist, applying backgrind tape over a top surface of the photoresist, backgrinding a back surface of the wafer to a specified thickness, removing the backgrind tape from the top surface of the photoresist, and removing the photoresist. The surface of the integrated circuit and any devices that may be bonded to the surface of the integrated circuit are protected by the photoresist layer during removal of the backgrind tape. |
申请公布号 |
US8679945(B2) |
申请公布日期 |
2014.03.25 |
申请号 |
US201213412562 |
申请日期 |
2012.03.05 |
申请人 |
MOORE GREGORY A.;HILL TYONDA;TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MOORE GREGORY A.;HILL TYONDA |
分类号 |
H01L21/46;H01L21/301;H01L21/78 |
主分类号 |
H01L21/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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