发明名称 |
Light emitting device package including light emitting diode, and lighting system having the same |
摘要 |
A light emitting device package of the embodiment includes a body; an insulating layer on a surface of the body; at least one electrode layer on the insulating layer; and a light emitting device on the at least one electrode layer. The electrode layer includes a thermal diffusion layer and a reflective layer on the thermal diffusion layer, and the thermal diffusion layer has a thickness thicker than a thickness of the reflective layer by at least twenty times. |
申请公布号 |
US8680552(B2) |
申请公布日期 |
2014.03.25 |
申请号 |
US201113095595 |
申请日期 |
2011.04.27 |
申请人 |
CHO BUM CHUL;LG INNOTEK CO., LTD. |
发明人 |
CHO BUM CHUL |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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