| 摘要 |
According to one embodiment, a semiconductor device includes a semiconductor element mounting unit, a first conductor, a semiconductor element, a first connection and a second connection. The first conductor is provided around the semiconductor element mounting unit. The semiconductor element is provided on the semiconductor element mounting unit and includes a first switch element and a second switch element provided parallel to the first switch element. The first connection and the second connection are provided on the first switch element side of an imaginary boundary line obtained by extending a boundary between the first switch element and the second switch element. The first connection and the second connection are electrically connected to the first switch element and the second switch element, respectively, and electrically connected to the first conductor. |
