发明名称 Method for self-aligned doubled patterning lithography
摘要 Various embodiments of the invention provide systems and methods for semiconductor device fabrication and generation of photomasks for patterning a target layout of line features and large features. Embodiments of the invention are directed towards systems and methods using self-aligned double pattern to define the target layout of line features and large features.
申请公布号 US8679981(B1) 申请公布日期 2014.03.25
申请号 US20100943808 申请日期 2010.11.10
申请人 WELING MILIND;HUCKABAY JUDY;SEZGINER ABDURRAHMAN;CADENCE DESIGN SYSTEMS, INC. 发明人 WELING MILIND;HUCKABAY JUDY;SEZGINER ABDURRAHMAN
分类号 H01L21/302 主分类号 H01L21/302
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