发明名称 Method of forming a chalcogenide material and methods of forming a resistive random access memory device including a chalcogenide material
摘要 A method of forming a chalcogenide material on a surface of a substrate comprising exposing a surface of a substrate to ionized gas clusters from a source gas, the ionized gas clusters comprising at least one chalcogen and at least one electropositive element. A method of forming a resistive random access memory device is also disclosed. The method comprises forming a plurality of memory cells wherein each cell of the plurality of memory cells is formed by forming a metal on a first electrode, forming a chalcogenide material on the metal by a gas cluster ion beam process, and forming a second electrode on the chalcogenide material. A method of forming another resistive random access memory device and a random access memory device including the chalcogenide material are also disclosed.
申请公布号 US8679914(B2) 申请公布日期 2014.03.25
申请号 US20100917930 申请日期 2010.11.02
申请人 QUICK TIMOTHY A.;MICRON TECHNOLOGY, INC. 发明人 QUICK TIMOTHY A.
分类号 H01L21/336;H01L21/00;H01L21/425 主分类号 H01L21/336
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