发明名称 |
Heterostructure containing IC and LED and method for fabricating the same |
摘要 |
A heterostructure containing IC and LED and a method of fabricating. An IC and an LED are established with the IC having a first electric-conduction block and a first connection block. The IC electrically connects to the first electric-conduction block. A first face of the LED has a second electric-conduction block and a second connection block. The LED is electrically connected to the second electric-conduction block. The first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block, and the first electric-conduction block are electrically connected with the second electric-conduction block to form a heterostructure. The heterostructure provides functions of heat radiation and electric communication for IC and LED. |
申请公布号 |
US8679891(B2) |
申请公布日期 |
2014.03.25 |
申请号 |
US201314019933 |
申请日期 |
2013.09.06 |
申请人 |
NATIONAL CHIAO TUNG UNIVERSITY |
发明人 |
CHEN KUAN-NENG;KO CHENG-TA;LO WEI-CHUNG |
分类号 |
H01L33/62 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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