发明名称 Heterostructure containing IC and LED and method for fabricating the same
摘要 A heterostructure containing IC and LED and a method of fabricating. An IC and an LED are established with the IC having a first electric-conduction block and a first connection block. The IC electrically connects to the first electric-conduction block. A first face of the LED has a second electric-conduction block and a second connection block. The LED is electrically connected to the second electric-conduction block. The first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block, and the first electric-conduction block are electrically connected with the second electric-conduction block to form a heterostructure. The heterostructure provides functions of heat radiation and electric communication for IC and LED.
申请公布号 US8679891(B2) 申请公布日期 2014.03.25
申请号 US201314019933 申请日期 2013.09.06
申请人 NATIONAL CHIAO TUNG UNIVERSITY 发明人 CHEN KUAN-NENG;KO CHENG-TA;LO WEI-CHUNG
分类号 H01L33/62 主分类号 H01L33/62
代理机构 代理人
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