| 摘要 |
In one embodiment, a device includes a first IC having a differential signal driver and a first isolation circuit configured to provide differential signals transmitted by the differential signal driver to a first pair of bond pads of the first IC. First and second bond wires are configured to provide differential signals from the first pair of bond pads to a second pair of bond pad included in a second IC. The second IC includes a second isolation circuit configured to provide differential signals from the second pair of bond pads to a differential receiver circuit of the second IC. The bond wires are specifically arranged such that a distance between the first and second bond wires varies by at least 10% as measured at two points along a length of the first bond wire. |
