发明名称 Integrated circuit metal gate structure and method of fabrication
摘要 A method of forming a gate structure is provided. The method includes providing a metal layer in the gate structure, the metal layer includes an oxygen-gettering composition. The metal layer getters oxygen from the interface layer, which may decrease the thickness of the interface layer. The gettered oxygen converts the metal layer to a metal oxide, which may act as a gate dielectric for the gate structure. A multi-layer metal gate structure is also provided including a oxygen-gettering metal layer, an oxygen-containing metal layer, and a polysilicon interface metal layer overlying a high-k gate dielectric.
申请公布号 US8679962(B2) 申请公布日期 2014.03.25
申请号 US20080264822 申请日期 2008.11.04
申请人 HOU YONG-TIAN;CHEN CHIEN-HAO;CHAO DONALD Y.;HUNG CHENG-LUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HOU YONG-TIAN;CHEN CHIEN-HAO;CHAO DONALD Y.;HUNG CHENG-LUNG
分类号 H01L21/3205 主分类号 H01L21/3205
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