METHOD FOR WAFER LEVEL BONDING WITH SOLDER FOIL

摘要

The present invention relates to a method for wafer level bonding wherein the method comprises the step of forming a first metal layer on a first wafer; the step of forming a second metal layer on a second wafer; the step of bonding the first wafer with the second wafer for the first metal layer to face solder foil with the solder foil arranged on the second metal layer.