发明名称 |
Carrier, semiconductor package and fabrication method thereof |
摘要 |
A fabrication method of a semiconductor package includes the steps of: providing a carrier having a concave portion and a releasing layer formed on a surface thereof; disposing a chip on the releasing layer in the concave portion; forming an encapsulant on the chip and the releasing layer; removing the releasing layer and the carrier; and forming a circuit structure on the encapsulant and the chip. The design of the concave portion facilitates alignment of the chip to prevent it from displacement, thereby improving the product reliability. A semiconductor package fabricated by the fabrication method is also provided. |
申请公布号 |
US8680692(B2) |
申请公布日期 |
2014.03.25 |
申请号 |
US201213440180 |
申请日期 |
2012.04.05 |
申请人 |
CHANG CHIANG-CHENG;LEE MENG-TSUNG;HUANG JUNG-PANG;CHIU SHIH-KUANG;SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
CHANG CHIANG-CHENG;LEE MENG-TSUNG;HUANG JUNG-PANG;CHIU SHIH-KUANG |
分类号 |
H01L23/28 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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