| 摘要 |
An electronic apparatus having a heat-dissipating structure capable of efficiently releasing heat generated at electronic components to the outside, superior in work efficiency at the time of assembly, and capable of avoiding misalignment in the electronic components. The electronic apparatus comprising a substrate, an electronic component mounted thereon, a heat-dissipating member for releasing heat generated by the electronic component to the outside, a heat-conducting sheet having flexibility, a first portion thereof being in contact with a rear surface of the electronic component between the substrate and the electronic component, a second portion thereof being in contact with the heat-dissipating member, a hard member disposed between the first portion of the heat-conducting sheet and the substrate, a material of the hard member being harder than that of the heat-conducting sheet, and a pressing unit disposed between the hard member and the substrate and configured to press the heat-conducting sheet against the rear surface of the electronic component. |
