发明名称 |
Semiconductor package and method for fabricating the same |
摘要 |
A semiconductor package includes a semiconductor chip having a first bump group and a second bump group, and a package substrate having a first pattern for data communication with the semiconductor chip and a second pattern for supplying power to the semiconductor chip or grounding the semiconductor chip, wherein the first bump group is disposed on the first pattern and the second bump group is disposed on the second pattern. |
申请公布号 |
US8680685(B2) |
申请公布日期 |
2014.03.25 |
申请号 |
US20100788901 |
申请日期 |
2010.05.27 |
申请人 |
LIM HWAN-SIK;KANG SUNWON;LEE JONGHO;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LIM HWAN-SIK;KANG SUNWON;LEE JONGHO |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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