| 摘要 |
According to the present invention, provided is a plating apparatus which comprises: a first anode plate; a second anode plate formed under the first anode plate; a first anode bar which supplies electricity to the first anode plate; a second anode bar which supplies electricity to the second anode plate; and a shield member which is arranged on the rear of the first anode plate, and which prevents the second anode bar from generating an electric current on the first anode plate. |
