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发明名称
积体电路晶片封装体
摘要
申请公布号
TWI431734
申请公布日期
2014.03.21
申请号
TW100123814
申请日期
2011.07.06
申请人
台湾积体电路制造股份有限公司 新竹市新竹科学工业园区力行六路8号
发明人
林文益;林柏尧
分类号
H01L23/34
主分类号
H01L23/34
代理机构
代理人
洪澄文 台北市南港区三重路19之6号2楼;颜锦顺 台北市南港区三重路19之6号2楼
主权项
地址
新竹市新竹科学工业园区力行六路8号
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