| 摘要 |
′Project′ The reliability of a semiconductor device is improved. ′Solution′ In the semiconductor device according to an embodiment 1, a mark (MK1) is installed in response to a bonding area of a target wire (BLW) exposed from an opening (OP1) installed in a solder resist (SR). According to this, in an alignment process of the wire bonding area, a coordinate position of the wire bonding area can be adjusted based on the mark (MK1) formed in response to the wire bonding area, not based on an end part of the opening (OP1) formed in the solder resist (SR). In addition, in the semiconductor device, the wire bonding area can be adjusted by camera recognition because the mark (MK1) that becomes a characteristic pattern is formed. [Reference numerals] (BLW) Target wire; (MK1) Mark; (OP1) Opening; (SR) Solder resist |
