扁平型导体用的连接器,申请号TW102219879-传众专利搜索

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发明名称	扁平型导体用的连接器
摘要
申请公布号	TWM475039	申请公布日期	2014.03.21
申请号	TW102219879	申请日期	2013.10.25
申请人	优群科技股份有限公司新竹市牛埔南路15之3号	发明人	李玉灿;林立山
分类号	H01R12/77	主分类号	H01R12/77
代理机构		代理人
主权项
地址	新竹市牛埔南路15之3号

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