半导体封装、具该封装的积体电路卡以及其制造方法,申请号TW097105921-传众专利搜索

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发明名称	半导体封装、具该封装的积体电路卡以及其制造方法
摘要
申请公布号	TWI431754	申请公布日期	2014.03.21
申请号	TW097105921	申请日期	2008.02.20
申请人	三星电子股份有限公司南韩	发明人	金东汉;崔基元
分类号	H01L25/04;H01L23/52	主分类号	H01L25/04
代理机构		代理人	詹铭文台北市中正区罗斯福路2段100号7楼之1;萧锡清台北市中正区罗斯福路2段100号7楼之1
主权项
地址	南韩

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