电感器之封装结构,申请号TW102216098-传众专利搜索

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发明名称	电感器之封装结构
摘要
申请公布号	TWM475010	申请公布日期	2014.03.21
申请号	TW102216098	申请日期	2013.08.28
申请人	陈介修桃园县芦竹乡芦兴街59号	发明人	陈介修
分类号	H01F17/00	主分类号	H01F17/00
代理机构		代理人
主权项
地址	桃园县芦竹乡芦兴街59号

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