DIE BONDER AND BONDING METHOD

摘要

The present invention relates to a bonding device with high operation ratio and a bonding method. The present invention inserts a collet holder, which is holding a used collet, from a first opening part wherein the surface of the first opening part is opened; combines the used collet with a first combination part mounted at the first opening part of a disposal part; removes and disposes the used collet from the collet holder by elevating the collet holder; inserts the collet holder from a second opening part of a supplying part wherein the surface of the first opening part is opened; holds the unused collet of the uppermost part of the overlapped multiple unused collets and purges from the first opening part; and mounts the unused collet of the uppermost part at the collet holder.