电路基板用之附有金属之聚合物薄膜及其制造方法,申请号TW094132340-传众专利搜索

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发明名称	电路基板用之附有金属之聚合物薄膜及其制造方法
摘要
申请公布号	TWI431700	申请公布日期	2014.03.21
申请号	TW094132340	申请日期	2005.09.19
申请人	味之素股份有限公司日本	发明人	织壁宏
分类号	H01L21/60	主分类号	H01L21/60
代理机构		代理人	林志刚台北市中山区南京东路2段125号7楼
主权项
地址	日本

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